technique - Blog - Global Risk Community2024-03-28T21:10:53Zhttps://globalriskcommunity.com/profiles/blogs/feed/tag/techniqueWhy Flip chip Technology is Getting Popularhttps://globalriskcommunity.com/profiles/blogs/why-flip-chip-technology-is-getting-popular-12020-08-19T07:39:46.000Z2020-08-19T07:39:46.000ZKBV Researchhttps://globalriskcommunity.com/members/KBVResearch<div><p>In the evolution of the packaging of electronics, the aim is to improve the density of packaging, lower cost, and increase performance. A chip of semiconductor is set up face down into the circuit board is perfect for size considerations as there is no extra space needed for contacting on the sides of the component. And this is done while increasing the reliability of the circuits. The whole process is known as flip-chip technology.</p><p></p><p><a href="{{#staticFileLink}}8028330098,original{{/staticFileLink}}" target="_blank"><img src="{{#staticFileLink}}8028330098,original{{/staticFileLink}}" class="align-center" alt="8028330098?profile=original" /></a></p><p></p><p>In the typical packaging process, the interconnection between the carrier and the die is set up by using a wire. The die is then connected to the carrier, and then a wire is bonded first to the die, then looped and bonded to the carrier. The length of wires is typically 1-5mm.</p><p></p><p>On the other hand, in <a href="https://www.kbvresearch.com/flip-chip-market/">flip-chip technology</a>, the interconnection between the die and the carrier is set up through a bump which is located on the die surface. The height of the bump is typically 0.06 to 0.1mm.</p><p></p><h2><strong>Flip-chip technology: Let’s know it from Scratch</strong></h2><p>Flip-chip is not a recently developed technology. Flip-chip technology has been developed by IBM Corporation since the 1960s to supply the connection between bonding pads of the chips and the metallization on the substrate. It is the first proposed method called the Controlled Collapse Chip Connection (C4) to displace wire bolding, expanded IO density, and cost reduction.</p><p></p><p>The C4 process begins with sticking under bump metallurgy (UBM) on the bonding pads of chips to provide a good union between the bonding pads and the bumps. Generally, UBM consists of three layers of barrier and/or adhesion layer, wetting layer, an oxidation barrier layer.</p><p></p><p>The performance in high-frequency applications of flip-flop technology is superior to other methods. This is achieved because flip flop technology minimized the length of the connection path. Moreover, due to the reduced number of connections, the reliability is better than with packaged components. There is only one level of joining connection between the chip and the circuit board in flip-chip technology.</p><p></p><p>In the advances of the packaging of electronics, the goal is to increase the density of packaging, lower cost, and improve performance. And this is done while increasing the reliability of the circuits. A chip of semiconductor is set up face down into the circuit board is perfect for size considerations as there is no extra space wanted for contacting on the sides of the component.</p><p></p><h2><strong>Benefits of Flip-chip Technology</strong></h2><p><strong>Increased functionality:</strong> The use of flip flop provides an increment in the number of I/O. Unlike in wire bonding, I/O is not limited to the perimeter of the chip. 400 pads can easily be handled by a flip-chip.</p><p></p><p><strong>Technical thresholds:</strong> Latest flip-chip designs are in production with 5900 bumps/chips at 0.2 mm pitch and 500 bumps/chips at 0.17mm pitch in area array configurations. Area array pitches in future production will continue to reduce to 0.15mm in the years to come as the technology of substrate becomes cost-effective.</p><p></p><p><strong>Reliability:</strong> Flip-chip processes include placement, reflow, and fluxing, as well as the dispensing process and underfill material. Underfill material is generally required on laminate substrates to eliminate solder fatigue in flip-chip technology. A well-characterized flip-chip assembly process can achieve high reliability and yields.</p><p></p><p><strong>Reduced Cost:</strong> Cost analyses and comparisons are dependent on the choice of substrate technology and modeling conditions. Flip-chip technology offers cost reductions in batch bumping processes and the underfill process.</p><h2><strong>Opportunities in the Future</strong></h2><p>Today flip-chip technologies are widely used in hearing aids, LCDs, automotive engine controllers, watches, mobile phones disk drivers, portable communications as well as in mainframe computers.</p><p>Flip-chip technology is comparatively cheaper than wire bonding. It is because bonding of all connections in the flip-chip system takes place simultaneously while one bond is made at a time in wire bonding technology.</p><p>Low cost, performance, and other beneficial factors have become the key drivers for the adoption of flip-chip technologies.</p><p></p><p>Flip-chip will continue to exist as growing technology in the coming future. It will continue to redefine the continuum of product and process solutions for the interconnection of the die to the exterior world.</p><p>Flip-chip technology has been there since the 1960s, it is still prevalent today. There are many technical and other variations in this technology with a different maturity level. Improvements are underway that will apply a backside lamination coating (BSL). This will protect the less active side of the die against mechanical impact and light. Moreover, BSL will improve the readability of the laser marking under bright field illumination.</p><h2><strong>Conclusion</strong></h2><p>As a flip-chip infrastructure is established, the cost will be reduced and the application space will broaden. Various factors from the Silicon industry have been the driver for the growth of flip-chip technology. The flip-chip market is in a growing phase and we hope it will flourish more in the future. </p><p></p><p>Today flip-chips remain a novel development with a big scope for further growth. Developments in the technology of semiconductors have created flip-chips with transistor counts and functions that were difficult to imagine a few years ago. Today flip-chips are available in various ranges of pitches to meet the demands and needs of specific applications. Owing to its benefits, this technology continues to hold a significant advantage over the other microelectronic packaging.</p><p></p><p>Flip-chip technology continues to develop and has an important role to play in various domains. It can adapt to the current challenges due to recent developments in bumping solutions that serve the most advanced packaging technologies. Flip-chip has been developed by electroplating or pastes printing processes.</p><p> </p><p>New developments in the low-cost package and high-density substrates have promoted the growth and use of flip-chip applications. Flip-chip technologies have been extensively used for the processors of smartphones, tablet games, personal computers, and servers, etc.</p></div>The Physical Vapor Deposition And The Major Use Cases Of This Industryhttps://globalriskcommunity.com/profiles/blogs/the-physical-vapor-deposition-and-the-major-use-cases-of-this2020-04-23T10:24:51.000Z2020-04-23T10:24:51.000ZKBV Researchhttps://globalriskcommunity.com/members/KBVResearch<div><p>Technological advancements are a significant growth factor for the global <a href="https://www.kbvresearch.com/physical-vapor-deposition-market/">physical vapor deposition</a> (PVD) industry. The increasing need for highly sophisticated surface-related properties such as super-plasticity, magnetic, optical, electronic and catalytic properties, advanced mono-structured coatings also contributes to the growth of this market. The rising performance and environmental benefits provided by these coatings are combined with the fast-growing manufacturing sector in developing markets.</p><p></p><p><a href="{{#staticFileLink}}8028313856,original{{/staticFileLink}}" target="_blank"><img src="{{#staticFileLink}}8028313856,original{{/staticFileLink}}" class="align-center" alt="8028313856?profile=original" /></a></p><h2><strong>What is physical vapor deposition?</strong></h2><p>Vapor deposition is a technique used in the manufacture of thin films and coatings. It is characterized by a cycle in which the substance moves from the condensed phase to the vapor phase and back to the condensed phase of the thin film. Several products like microelectronics, storage devices, cutting tools, medical equipment, solar panels, etc. are coated with thin protective film in the coating procedure.</p><p></p><p>There are two kinds of physical vapor deposition- evaporation and sputtering. Materials that get vaporized through high temperatures, such as refractory oxide compounds and refractory metals, also need a higher temperature of the targeted electron beam source (E-B). Nearly any substance that can be evaporated by RH may be evaporated by E-B. However, the power (high voltage) of fluoride compounds must be reduced to avoid dissociation. Metals like aluminum, gold, and copper have lower evaporation temperatures as compared to dielectric and RH, which is used more commonly.</p><p></p><p>Thermal evaporation uses heating of a material to create a vapor that condenses the coating over a substrate. The heating process can be carried out by various methods, such as electrical resistance, hot filament, electron or laser beam, and electrical arc. Sputtering requires electrical plasma generation between the coating species and the substrate. Ion plating is simply a variation of thermal evaporation and sputtering.</p><p></p><h2><strong>Various use cases that have made the physical vapor deposition technology prevalent:</strong></h2><h3><strong>PVD aluminum metalized finish in automotive applications</strong></h3><p>The accelerated demand for microelectronics in various applications, such as the automotive industry, plays a major role in driving market growth. PVD Aluminum Metallic Finish refers to the process of evaporation of aluminum coating to a non-metallic substrate. The layer must be vacuum-compatible. Tool materials, brass, glass, steel, zinc and ABS and polycarbonate plastic are most common.</p><p></p><p>PVD aluminum coating is a good alternative for applications that require very thin functional coatings. The PVD coating process deposits a layer of high-density material and that is only a few microns thick. When applied, it is hardly possible to remove the coating and do not wear it. This provides the aesthetic look of metal parts thereby lowering costs. It’s safer than any other process. Vacuum metalizing does not require the mixing of hazardous chemicals. The purest method reduces the risks of chemicals that cause human problems.</p><p></p><h3><strong>Functional PVD coatings improve medical device performance and life</strong></h3><p>Whilst the medical device sector keeps growing rapidly, manufacturers are more prone to facing a variety of challenges if they are to distinguish products in a highly competitive market. With this in consideration, greater emphasis is placed on functional coatings applied to stainless steel, titanium and other necessary medical equipment, ranging from implants to scalpels, needle drivers, bone saws, as well as reamers.</p><p></p><p>When manufacturers first started coating tools, their primary objective was to improve instrument appearance and to enhance identification during surgery. Titanium nitride, with its easily identifiable color of gold, rapidly became the coating of choice for this purpose. Nevertheless, OEMs are now striving to move beyond aesthetics by adding titanium nitride and other revolutionary physical vapor deposition (PVD) coatings to enhance wear resistance, minimize galling between sliding parts, increase lubricity as well as help to retain sharp edges on cutting instruments.</p><p></p><h3><strong>Aerospace industry turns to PVD coatings to replace hard chrome</strong></h3><p>A key supply chain focus for aircraft manufacturers has been the need for a suitable substitute for hard chrome in aerospace components. This may be attributable to observed health risks to staff and the environmental impact of exposure to hexavalent chromium. It is a carcinogen that emerges during the chromium plating process and is the most toxic type of chromium. As a result, chromium is a highly regulated chemical in major sectors of the world.</p><p></p><p>PVD defines a variety of methods of vacuum deposition that can be used to manufacture thin coatings. PVD is usually used to paint components at a relatively low coating temperature of 160-500°C (212-932°F). Such temperatures are suitable because they are below the temperature of the steels, which helps to prevent alteration of the fundamental properties of the material.</p><p></p><p>Among many of the PVD options, several carbon-based coatings will provide a rare combination of extreme surface durability, low friction, and anti-corrosion properties. For example, BALINIT C from Oerlikon Balzers, a manufacturer of coatings, has drawn the attention of some of the world's leading aerospace manufacturers, including Airbus.</p><p></p><h2><strong>To conclude</strong></h2><p>The physical vapor deposition market is driven primarily by increasing demand for reliable and durable coatings in medical equipment, especially from developing economies. As a result, the application category of medical devices is projected to have a strong growth potential over the estimated time period.</p><p></p><p><strong>Free Valuable Insights:</strong> <a href="https://www.kbvresearch.com/news/physical-vapor-deposition-market/">Global Physical Vapor Deposition Market to reach a market size of USD 25.5 billion by 2025</a></p><p></p><p>Other applications for PVD may include aluminum tracks, ceramic resistors for electronic circuitry, optic coatings, plastic coatings as well as coatings to avoid wear on machines and press tools. Thin-film applications are comprehensive and can also be used where anti-corrosive, anti-fogging, stain-repellent, non-stick, electrically insulated, low friction and wear-resistant properties are needed.</p><p></p><p>PVD materials are wonderful elements that reflect people's daily lives in many ways. The process will continue to play a key role in how and why products are developed. With a nearly infinite variety of unique properties, it is always possible to imagine a whole new world of applications.</p></div>