In the digital age, AI always on, and data centers never off. As rack power moves toward 600 kW and cooling accounts for up to 40% of total energy consumption, the data center industry faces an unprecedented challenge: delivering uninterrupted, efficient operations for the explosive growth of Generative AI. Traditional air cooling is reaching its limits, regulatory frameworks across Europe demand greater sustainability, and ultra-high-density computing is reshaping every aspect of data center design—this is where the future of thermal management is forged.
Join us on November 17–18, 2026 in Frankfurt, Germany, at the Europe Data Center Cooling and Thermal Management Forum, where industry leaders, technology innovators, and decision-makers will come together to shape the next generation of resilient, efficient, and scalable cooling solutions.
What You’ll Gain
1, A Strategic View of the AI Infrastructure Shift
Explore how AI workloads are transforming data center demand, design, and deployment strategies across Europe and globally.
2, Deep Dive into Next-Gen Cooling Technologies
From direct-to-chip (D2C) to immersion cooling, understand how liquid cooling is moving from pilot projects to large-scale deployment—and what it means for your business.
3, Efficiency Meets Sustainability
Learn how leading operators are optimizing PUE and WUE, reducing costs, and aligning with Europe’s strict sustainability and energy efficiency regulations.
4, Real-World Deployment & Retrofitting Strategies
Discover how to upgrade legacy air-cooled facilities, accelerate delivery with modular data centers, and integrate cooling systems from day one.
5, Future-Proofing Data Centers
Gain insights into resilient system design to withstand extreme climate conditions, power instability, and AI-driven demand spikes.
Key Highlights of the Agenda
- AI-Driven Data Center and Cooling Market Dynamics, Opportunities, and Infrastructure Transformation
- Scaling Liquid Cooling: From Pilot to Industrial Deployment of D2C and Immersion Cooling
- Energy Efficiency, Cost Optimization, and PUE Management in High-Density Environments
- Sustainable Data Center Development in Europe: Heat Reuse, Water Efficiency (WUE), and Decarbonization Policie
Interactive panel discussions will bring together experts from across the value chain — chip designers, hyperscalers, data center operators, and cooling technology pioneers. Key panels include:
- Next-Gen AI, Next-Gen Data Centers, Next-Gen Cooling
- Cooling Architecture from Chip to Data Center
- Managing PUE & WUE Under Surging AI Demand and Tightening Regulations
- Balancing AI Compute Growth, Grid Constraints and Cooling Efficiency
Who Will You Meet?
This forum gathers a high-level audience across the ecosystem:
Hyperscale & colocation data center operators
AI infrastructure and cloud providers
Chip and server manufacturers
Cooling technology innovators
Engineering, construction, and design leaders
Investors, policymakers, and sustainability experts
As the industry enters a new era of ultra-high-density computing, cooling is no longer just an operational concern—it is a strategic differentiator.
The Europe Data Center Cooling and Thermal Management Forum 2026 is your opportunity to:
- Stay ahead of technology disruption
- Connect with top-tier industry leaders
- Discover actionable solutions for real-world challenges
- Position your organization at the forefront of AI infrastructure innovation
For more information and registration, contact the organizing team or visit the official event website.
Website link: https://www.ecv-events.com/EDCCTMF2026?cci=45
Email: marketing@ecvinternational.com
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