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Why Flip chip Technology is Getting Popular

In the evolution of the packaging of electronics, the aim is to improve the density of packaging, lower cost, and increase performance. A chip of semiconductor is set up face down into the circuit board is perfect for size considerations as there is no extra space needed for contacting on the sides of the component. And this is done while increasing the reliability of the circuits. The whole process is known as flip-chip technology.

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In the typical packaging process, the interconnection between th

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