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In the evolution of the packaging of electronics, the aim is to improve the density of packaging, lower cost, and increase performance. A chip of semiconductor is set up face down into the circuit board is perfect for size considerations as there is no extra space needed for contacting on the sides of the component. And this is done while increasing the reliability of the circuits. The whole process is known as flip-chip technology.

In the typical packaging process, the interconnection between th

Technological advancements are a significant growth factor for the global physical vapor deposition (PVD) industry. The increasing need for highly sophisticated surface-related properties such as super-plasticity, magnetic, optical, electronic and catalytic properties, advanced mono-structured coatings also contributes to the growth of this market. The rising performance and environmental benefits provided by these coatings are combined with the fast-growing manufacturing sector in developing ma